How much adhesive has been applied and where?
When is the adhesive fully cured?
These two questions have plagued many instances of adhesive usage, often forcing “belt-and-braces” measures, generally costing valuable time. Now, Intertronics, together with sales partner, DYMAX, have what may be the first credible solution to both questions – See-Cure technology.
See-Cure technology is an indicator of cure which builds a visible quality assessment factor into the assembly process. The colour change is directly linked to the photo-initiator in the adhesive.
Adhesives formulated with See-Cure technology are bright blue in their uncured state. This makes them easily seen on the surface of substrates, in deep wells, or when placed between two layers of material. Any voids in the bond-line can be immediately corrected before curing.
The colour of a See-Cure adhesive turns to clear after the adhesive is cured. This serves as a visible indicator that confirms the adhesive has received the sufficient dose of energy to reach full cure.
The blue coloured See-Cure adhesive will not permanently stain or, in the case of medical device adhesives, affect the bio-compatibility of the component surfaces that they contact. Since the blue colour is extremely visible, simple vision systems may be incorporated into assembly processes prior to curing in order to easily identify adhesive coverage and profile.
DYMAX See-Cure technology has been specifically introduced into a range of UV curing adhesives for bonding plastics. The products have special significance in the medical device manufacturing industry, where the extra process assurance can give distinct advantages in this critical area. Further information regarding Intertronics’ products can be found at www.intertronics.co.uk.
For more infomation on this company click here
To add your company click here
Record set at EPFL hyperloop test facility
The problem with hyperloops is capacity. High speed and small vehicles limit capacity. Junction design is key. Road vehicles can change lane with...