Intel has announced that its future processors, beginning with its family of 45nm high-k metal gate (Hi-k) processors, are going 100 per cent lead-free from the second half of 2007.
Lead is used in a variety of micro-electronic packages and the ‘bumps’ that attach a chip to the packages. Package designs include pin grid array, ball grid array and land grid array, and all are 100 per cent lead-free in Intel's 45nm Hi-k technology generation. In 2008, the company will also transition its 65nm chipset products to 100 per cent lead-free technology.
Due to lead's potential impact to the environment and public health, Intel has worked alongside suppliers and other electronics manufacturers to develop lead-free solutions. In 2002, Intel produced its first lead-free flash memory products. In 2004, the company began shipping products with 95 per cent less lead than previous microprocessor and chipset packages.
To replace the remaining 5 per cent - about 0.02g - of lead solder historically found in the first-level interconnect in processor packages, Intel will use a tin/silver/copper alloy. Because of the complex interconnect structure of Intel's silicon technologies, a great deal of engineering work was required to remove the remaining lead in Intel's processor packages and integrate a new solder alloy system.
Intel engineers developed the assembly manufacturing processes using the new solder alloys, and were able to accomplish this while maintaining levels of performance, quality and reliability.
Report finds STEM job candidates facing bias after career break
Can an employer´s preference for a prospective candidate WITH recent experience over one who does not - perhaps through taking a career break - when...