Harwin has introduced a new range of surface mount EMI/RFI shield clips which eliminate secondary soldering operations. Harwin’s RFI shield clips are positioned on the board and soldered using standard SMT placement equipment. The shielding can is then simply pushed into place during final assembly. It is possible to remove and refit the can which simplifies the adjustment and rework time and reduces costs. The components are supplied in industry-standard tape & reel packaging and available in two sizes.
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Promoted content: Does social media work for engineers – and how can you make it work for you?
So in addition to doing their own job, engineers are expected to do the marketing department´s work for them as well? Sorry, wait a minute, I know the...