Cray and Intel sign HPC agreement

and

have signed an agreement to advance high-performance computing (HPC) on Intel microprocessors while delivering new Intel and Cray technologies in future Cray servers.

The two companies plan to explore future supercomputer component designs such as multi-core processing and advanced interconnects over the next several years. It is hoped that the collaboration will lead to the development of HPC that will help solve some of the most complex scientific, engineering and humanitarian challenges.

‘This collaboration provides the HPC market segment with access to the best microprocessors the industry has to offer at any point in time, in the most advanced supercomputers in the world,’ said Peter Ungaro, president and CEO of Cray.

‘The combination of this industry leadership and technical strength will allow HPC users to take advantage of future Xeon and other Intel processor technologies,’ added Patrick Gelsinger, senior vice president and general manager of Intel's Digital Enterprise Group. ‘Together we will enable fundamental and historical problems of science and industry to be solved.’