Heat-resistant sensing and computing chips made of silicon carbide (SiC) can handle higher voltages, temperatures and radiation levels than silicon alone, and have applications across sectors including transport, energy and space exploration. Engineers at NASA's Glenn Research Center have been exploring its potential, developing an SiC circuit that can withstand 500° C for thousands of hours, with a view to operating on Venus.
The new project will scale up NASA's technology and manufacturing process to a modern wafer size and ‘democratise’ SiC chip design. Additional collaborators include the University of Michigan, GE Aerospace Research, Ozark Integrated Circuits (Ozark IC) and semiconductor manufacturer Wolfspeed. The project will launch with $2.4 million in initial funding and could receive up to $7.5 million over three years.
"NASA, GE Aerospace and Ozark IC have done an amazing job of developing this technology, which is very impactful for a variety of applications,” said principal investigator Becky Peterson, associate professor of electrical and computer engineering and director of the University of Michigan’s Lurie Nanofabrication Facility. “This project will provide a critical pathway to advance and commercialize that technology.
"We need advanced semiconductors produced domestically that can perform in these challenging high temperature environments."
As part of the project, NASA Glenn and GE Aerospace will work together to scale what's referred to as the high temperature SiC junction field effect transistor, or JFET, fabrication process from 100- to 150-millimeter wafers.
“SiC-based high temperature electronics will be a key enabler for delivering new sensor and actuator functionality that improves the capability of future DoD engine platforms,” said Aaron Knobloch, platform leader, controls and electrical systems at GE Aerospace Research.
“Beyond jet engines, the ability to handle more extreme temperature capabilities could open exciting new applications in control and sensing for hypersonic applications."
The project is one of 34 technical projects funded in 2024 by the U.S. Department of Defense through the Microelectronics Commons program, established by the CHIPS Act to boost US microelectronics.
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