30 million transistor mobile chip

has launched a mobile phone chip with 65nm CMOS process technology and more than 30 million transistors on a space of just 33mm

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Infineon said the technology features high performance at low power consumption and is the most advanced semiconductor technology for logic circuitry that the company is preparing for mass production. The first products with this new technology are expected to be market-ready towards the end of 2006.

The recently tested chip puts more than 30 million transistors on a space of just 33mm² and brings digital and analogue circuitry to cell phones, such as MCU/DSP cores, storage and signal/mixed-signal in 65nm technology. This space-saving technology was also used to manufacture high-frequency circuits for the first time.

Infineon developed this technology in the leading 65/45-nm research and development alliance ICIS consisting of IBM, Chartered and Samsung. The mobile communications chip developed by Infineon was produced in the frame of a manufacturing agreement with Chartered in Singapore.